U109 Solid State Technician - 1st Shift

RELOCATION ASSISTANCE: Relocation assistance may be available

CLEARANCE TYPE: Secret

TRAVEL: No

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is seeking Solid State Technicians to join its team of qualified, diverse individuals to support its organization. This position is located in Linthicum, MD.

Primary Functions:

Solid State Technicians perform a variety of processes to support the development, fabrication, testing, and assembly of semiconductor devices in accordance with operational goals.  Solid State Technicians are responsible for the setup, operation, and adjustment of a variety of process and measurement tools to support integrated circuit production and engineering development efforts.  Solid State Technicians may be asked to perform process calculations, summarize data, prepare basic reports, and maintain electronic data logs for engineering staff.  Solid State Technicians must adhere to all safety policies and maintain a clean, orderly work area at all times.  Given the diverse nature of the production needs at ATL, a Solid State Technician will be assigned to one or more of the following specific process areas:

Wafer Fabrication

• Chemical Mechanical Planarization (CMP):  Using a combination of chemical reactivity and mechanical forces to remove excess material from the surface of a wafer with high precision and uniformity.

• Chemical Vapor Deposition (CVD): Creating high quality, high performance thin films where a volatile precursor gas reacts with the wafer/substrate surface in a chamber. 

• Diffusion:  Using high temperature furnaces to drive species into the substrate or to create thin inter facial layers by introducing a gas or solid source material to modify electrical properties.

• Dry Etch: Removing material deposited onto wafers by using reactive ion etching (RIE) for anisotropic removal or through inductively coupled plasma (ICP) etch for isotropic removal of material.

• Implant: Changing physical, chemical, or electrical properties of a substrate by accelerating and bombarding ions of a particular element into the wafer at a high energy.

• Metal Deposition: Metallic films can be deposited onto substrates using a variety of techniques including sputter physical vapor deposition (PVD), electron beam PVD, thermal evaporation, and electroplating.

• Photolithography:  Patterning onto the surface of a wafer by exposing a specific wavelength of light through a photo mask onto a photosensitive material spun onto the wafer surface.

• Clean / Wet Etch:  Cleaning substrates before a sensitive downstream process step or stripping undesirable films from surfaces through isotropic wet etch processes.

• Pre-Assembly:  Wafer bonding, lapping, polishing, grinding, taping, and sawing processes that are performed in advance of moving wafers to the assembly area.

• Metrology / Inspection:  Monitoring of critical product specifications including critical dimensions, overlay, f