2026 Electrical Engineer Intern - Linthicum MD

RELOCATION ASSISTANCE: No relocation assistance available

CLEARANCE TYPE: Polygraph

TRAVEL: No

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

An internship at Northrop Grumman is unique. Sure, you’ll learn new skills, explore our enterprise, network with experts, connect with thought leaders, and finish with a resume that opens doors. But you’ll gain something even more valuable: pride in what you’ve done. Join us and launch your career. We’ll support you with training, employee resource groups, and our shared vision of global security.

The Northrop Grumman Microelectronics Center (NGMC) is a leader in advanced development of semiconductor system solutions for the military, aerospace, and commercial markets.  For more than 50 years, we have been offering a wide range of trusted foundry and semiconductor services that deliver high performing and reliable microelectronics. Our wide breadth of technologies and capabilities includes research in advanced computing solutions to provide our customers with unique “More than Moore” solutions. Microelectronics | Northrop Grumman 

Our Microelectronics Design & Applications (MDA) business unit is leading efforts to transform computing, combining the unique properties of superconductivity and quantum mechanics to develop revolutionary energy-efficient computing systems. The qualified candidate will work in a fast-paced team environment alongside a broad array of engineers to make these next generation processing solutions a reality. 

Northrop Grumman is seeking Electrical Engineers for an internship opportunity. This position will be located in-person at our Mission Systems sector in Linthicum, MD. The qualified candidate will become part of Northrop Grumman’s Microelectronics Center, Microelectronics Design & Applications business unit.

Roles and Responsibilities:

• Designing, modeling, and verifying RF, microwave, and mixed signal subsystem assemblies
• Support verification efforts for RF, Analog, and Digital hardware designs
• Collaborating with peer functions such as Mechanical, Manufacturing, Test, and Integrated Circuit Design Engineers
• Deriving and trading requirements with subsystem engineers and component-level designers
• Working directly with component level design peers developing custom RF integrated circuit designs to meet assembly-level requirements

Basic Qualifications:

• Be a student who is enrolled full-time and pursuing an undergraduate or graduate degree from an accredited college/university and will be enrolled full time in Fall 2026

• Be majoring in Electrical Engineering, Microelectronic Engineering, Computer Engineering, Quantum Science, or other closely related STEM field

• Be available to work full-time (40 hours per week) for at least 10 weeks during Summer 2026
• Be able to obtain a U.S. Government security clearance (U.S. citizenship is a pre-requisite)

• The ability to obtain Special Access Program within a reasonable period of time, as determined by the company to meet its business needs 

Preferred Qualifications:

• Have an overall cumulative GPA of 3.0/4.0 or higher
• Coursework in Quantum Mechanics and/or Electromagnetics
• Knowledge of HFSS or COMSOL simulation tools
• Prior internship, research, or project experience working with electronics, mechanical requirements, and schematic drawings
• Well versed in working with EM tools for modeling for RF packaging effects (CST Studio, Sonnet, ADS, HSPICE, SI-Wave, Sigrity)
• Experience with spectrum and network analyzer techniques for EMC measurements
• Prior experience with packaging technologies (ceramic and laminate chip-level packages, printed circuit boards, interposers, wire bonding, etc.)
• Experience with Cryogenic test stands, superconductivity and mechanical CTE
• Ha