Director of Electronic Design Automation Product Management, Texas Institute for Electronics

Job Posting Title:

Director of Electronic Design Automation Product Management, Texas Institute for Electronics

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Hiring Department:

Texas Institute for Electronics

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Position Open To:

All Applicants

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Weekly Scheduled Hours:

40

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FLSA Status:

To Be Determined at Offer

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Earliest Start Date:

Ongoing

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Position Duration:

Expected to Continue

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Location:

PICKLE RESEARCH CAMPUS

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Job Details:

General Notes

About TIE

Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Our Mission

A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Our Impact

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

Our Technology

Our 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to re-imagine an industry from the ground up and build transformative products with global impact.

Purpose

This position will lead the implementation, strategy, execution, and team responsible for electronic design automation (EDA) enablement for TIE’s multi-component and chiplet integration platforms. The Director will be hands-on and oversee the development of design kits, simulation tools, and reference flows, working cross-functionally to align roadmaps and ensure scalable deployment across design teams.

Responsibilities

• Lead the technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verification, and enablement collateral to accelerate customer adoption of TIE’s technologies.
• Collaborate closely with TIE subcontractors to clearly define Statements of Work (SoW) in quantifiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed. You’ll ensure everyone is on the same page and that expectations translate into measurable outcomes.
• Act as a hands-on technical authority for EDA packaging workflows, bridging electrical, thermal, and mechanical simulation domains while leading a team of engineers. You will represent TIE in technical working groups, customer design reviews, and ecosystem partnerships.
• Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors (Synopsys, Cadence, Ansys, Siemens) to ensure design enablement flows are aligned, validated, and continuously improved.
• Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication. You will deliver predictable outcomes in fast-paced, multi-stakeholder engagements.
• Create technical documentation and collateral, including user guides, reference flows, and onboarding materials to support customer design teams and strengthen TIE’s position as an EDA innovator.
• Monitor EDA market trends and competitive developments, providing actionable insights to guide tool integration, design enablement priorities, and platform differentiation.
• Champion a culture of accountability and transparency across all program workstreams—ensuring stakeholders are informed, expectations are managed, and commitments are met.

Required Qualifications

• BS in Electrical Engineering, Computer Engineering, or related discipline.
• 8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows.
• Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous integration.
• You have built and deployed packaged-related PDKs/ADKs and understand the nuances of modeling, simulation, and qualification across electrical, RF, mechanical, and thermal domains.
• Exceptional communication skills. You know how to simplify the complex, create clear deliverables,