Principal Engineer, Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration!

As a Principal Engineer on our APTD team in Boise, you’ll play a key role in shaping next‑generation semiconductor packaging technologies. This is a highly influential position where your technical insight and leadership directly impact product quality, reliability, yield, and cost. You’ll work across disciplines, mentor teams, drive innovation, and help guide the packaging technology roadmap.

Responsibilities:

• Identify, diagnose, and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology

• Coordinate and carry out process, equipment, and material evaluation/optimization to implement changes at process step

• Collaborate with internal and external partners to enable seamless technology integration

• Lead technical project teams to solve complex problems, improve yield, and optimize cost

• Guide packaging technology roadmaps and assess competitive trends

• Manage, audit, and collaborate with customers and foundry engineering to achieve quality, cost, and risk management objectives

• Mentor other engineers, troubleshoot sophisticated issues, and contribute through patents, papers, and technical presentations

Minimum Qualifications:

• 5+ years of experience in semiconductor advanced packaging

• BS, MS, or PhD in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field

• Expertise in High Bandwidth Memory, 2.5D integration, and emerging 3D integration including Hybrid Bonding

• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking

• Experience in DRAM manufacturing and OSAT environments

Preferred Qualifications:

• Understanding of DRAM wafer structure and process flows

• Proficiency in an East Asian language

• Track record of innovation proven through patents or technical publications

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.  Additionally, Micron benefits include a robust paid time-off program and paid holidays.  For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micr